At SPIO Systems, our proprietary SPIO technology enables the miniaturisation of conventional optical devices into compact optical chips. By leveraging a frameless approach based on our polymer-on-glass wafer platform, we unlock three key advantages:
Miniaturisation by a factor of 10+: Enables the development and production of new applications where small form factor and mobility are critical.
Scalability: Achieved through a high degree of parallel processing and passive alignment in the production of optical devices.
Cost Efficiency: Our wafer-based production platform eliminates much of the manual assembly—the most costly part of conventional instrument manufacturing.
This technology empowers our partners to innovate without compromise; delivering high-performance optical devices in a fraction of the size and cost.