Based in Wales, RAM Innovations is the UK’s leading specialist in heterogeneous integration achieved through embedded die packaging (EDP)—advancing high-performance power electronics with next-generation solutions for wide band gap (WBG) semiconductors.

RAM has developed a patented process that embeds bare die directly into PCBs. The result? Dramatically shorter power loops, reduced parasitic inductance, improved thermal performance, and significantly smaller, lighter, and more efficient power modules.

From automotive and aerospace to medical, space, and defence, RAM’s embedded packaging solutions deliver robust reliability, enhanced EMI shielding and proven performance.

With ISO 9001 certification and a scalable automated production model, RAM is enabling global innovation—collaborating with major US power electronics firms, UK manufacturers, and high-volume fabrication partners.