Finetech

Stand: C52
Finetech is a Berlin-based manufacturer of high-precision die bonding and SMD rework equipment for the semiconductor and microelectronics industry. Founded in 1992 and recognized with the EY Entrepreneur of the Year Award 2024 in the Innovation category, the company has grown from a start-up into a leading global supplier, serving more than 3,000 customers worldwide. From its Berlin headquarters, locations on three continents and a worldwide network of representatives, Finetech combines global reach with local support. For technology innovators, the hardest part is rarely the device itself. It is moving a process from the lab to production without losing months, yield or precision. Finetech closes that gap. One FINEPLACER platform scales from manual R&D systems through fully automated tools to the new FiNEXT P3 high-mix 12 inch wafer production system, all with sub-micron accuracy and support for indium bump, thermocompression, adhesive, ultrasonic and laser-assisted bonding. Because the process developed early carries through to volume, customers reduce risk, protect yield and reach production faster, without switching suppliers or starting over. This matters most where there is little margin for error: silicon photonics and co-packaged optics, quantum and hybrid assemblies, MEMS, microLED displays, RF modules, implantable medical electronics and space-grade laser diodes. Backed by in-house design and tooling, ISO class 6 and 7 cleanrooms, ISO 9001 and 14001 certification and over 200 experts worldwide, Finetech is the long-term partner that turns ambitious device concepts into products built at scale.
Visit website (opens in a new tab)
Loading