Headquartered in Berlin, Germany, Finetech is a leading global supplier of high-precision die bonding and micro-assembly equipment with more than 30 years of experience supporting customers in the development and manufacturing of semiconductor and photonics devices, as well as advanced packaging applications. The company supports customers from early feasibility and process development through fully automated production, with continuous support for upgrades, updates and evolving applications.
Finetech’s product range includes manual and semi-automated die bonders for R&D as well as scalable platforms for industrial manufacturing, all built on a consistent technology foundation that enables a seamless transfer from prototype to reliable high-yield production. The systems integrate a wide range of advanced bonding technologies to support precise and complex assembly processes, including heterogeneous integration, hybrid bonding and direct bonding.
Through its cross-system Prototype-to-Production approach, Finetech helps customers develop robust processes early and transition them efficiently into manufacturing environments with predictable performance. Finetech also offers dedicated SMD rework solutions for electronics manufacturing and failure analysis applications.
With subsidiaries on three continents and a global network of representatives, Finetech works closely with customers worldwide to provide fast support, local expertise, and long-term technical partnerships.
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