Applied Microengineering Ltd

Stand: G12
AML designs and manufactures Wafer Bonding systems with in-situ alignment capabilities. The AWB aligner-bonders provide flexibility and enable a wide range of bonding techniques to be carried out. The AWB systems are ideally-suited to process development, R&D and commercial production using wafer sizes up to 8”, and are supplied to customers worldwide. The systems feature an integral, optical wafer-to-wafer alignment system as standard, with the capability of 1µm accuracy. All bonding process steps can be carried out sequentially within the bonding chamber, without exposure to air between stages: - Wafers are held in separation, up to 30mm apart - operation under vacuum or controlled atmosphere - independent heating of upper/lower wafers, up to 560°C - in-situ radical-activation or chemical treatment of bonding surfaces - in-situ alignment, immediately prior to bonding - bonding, with contact forces up to 40kN The systems offer auto-align and all bonding facilities via user-programmed recipes, and are readily configured to meet customer requirements.
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