Balancing Performance & Efficiency in Next-Generation Chip Design (panel)

29 Sept 2026
  • Balancing PPAC in increasingly complex chip architectures 

  • Architecture-level trade-offs for AI, automotive & edge applications 

  • System design strategies for chiplets, heterogeneous compute & advanced packaging 

  • Managing IP integration, verification & security across complex design ecosystems 

  • Bridging design & deployment: aligning silicon decisions with system requirements & cross-team integration 

Speakers
Elis Thomas
Elis Thomas, Programme Manager for Tech & Innovation - TechUk
Jerome Toublanc
Jerome Toublanc, Business Development Executive - Synopsys
Louis P. Alarcon
Louis P. Alarcon, Head, UP Electrical & Electronics Engineering Institute Microlab Program Leader - Center for Integrated Circuits & Devices Research